Description
Unit Size: Each
Key features
• New multi-ion species plasma source (Xe+ / Ar+) for outstanding performance in high-volume removal and precision milling supporting diagonal mill, delayering, and cross section applications.
• New Metrology Studio user interface with flexible SMART targeted activities provides faster time to recipe and simplifies automated metrology development.
• Thermo Scientific MultiChem™ Gas Delivery System provides advanced capabilities for electron and ion beam-induced deposition and etching.
• ECS enables host-driven factory automation.
• iFast Software provides full orchestration of automated wafer navigation, milling, imaging, metrology, 3D reconstruction, virtual slice metrology, and data reporting.
• New Job History Services and web-based unified user interface, Cortex, provide a seamless user experience navigating to process images, designing metrology recipes, viewing metrology results, and 3D reconstructions.
• High-performance server to support acceleratedcomputation.
• New in-chamber, fixed sample calibration standards enable tool calibration and monitoring between wafer loads for improved availability.
• Standardized validation process for metrology performance matching and verification.